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AC 43.13-1B 9/8/98 e. Self-tapping screws should not be used for bonding purposes. Only standard threaded screws or bolts of appropriate size should be used. f. Exposed conducting frames or parts of electrical or electronic equipment should have a low resistance bond of less than 2.5 millohms to structure. If the equipment design includes a ground terminal or pin, which is internally connected to such exposed parts, a ground wire connection to such termi nal will satisfy this requirement. Refer to manufacturer’s instructions. g. Bonds should be attached directly to the basic aircraft structure rather than through other bonded parts. h. Bonds must be installed to ensure that the structure and equipment are electrically stable and free from the hazards of lightning, static discharge, electrical shock, etc. To ensure proper operation and suppression of ra dio interference from hazards, electrical bonding of equipment must conform to the manufacturer’s specifications. i. Use of bonding testers is strongly rec ommended. j. Measurements should be performed after the grounding and bonding mechanical connections are complete to determine if the measured resistance values meet the basic re quirements. A high quality test instrument (AN AN/USM-21A or equivalent) is required to accurately measure the very low resistance values specified in this document. Another method of measurement is the millivolt drop test as shown in figure 11-19. k. Use appropriate washers when bond ing aluminum or copper to dissimilar metallic structures so that any corrosion that may occur will be on the washer. Figure 11-19. Millivolt drop test. Page 11-74 Par 11-188PDF Image | AFS-640
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