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9/8/98 AC 43.13-1B f. Grounds for Sensitive Circuits. Spe cial consideration should be given to grounds for sensitive circuits. For example: (1) Grounding of a signal circuit through a power current lead introduces power current return voltage drop into the signal cir cuit. (2) Running power wires too close will cause signal interference. (3) Separately grounding two compo nents of a transducer system may introduce ground plane voltage variations into the sys tem. (4) Single point grounds for signal cir cuits, with such grounds being at the signal source, are often a good way to minimize the effects of EMI, lightning, and other sources of interference. 11-187. BONDING. The following bonding requirements must be considered: a. Equipment Bonding. Low-impedance paths to aircraft structure are normally required for electronic equipment to provide radio fre quency return circuits and for most electrical equipment to facilitate reduction in EMI. The cases of components which produce electro magnetic energy should be grounded to struc ture. To ensure proper operation of electronic equipment, it is particularly important to con form the system’s installation specification when interconnections, bonding, and ground ing are being accomplished. b. Metallic Surface Bonding. All con ducting objects on the exterior of the airframe must be electrically connected to the airframe through mechanical joints, conductive hinges, or bond straps capable of conducting static charges and lightning strikes. Exceptions may be necessary for some objects such as antenna elements, whose function requires them to be electrically isolated from the airframe. Such items should be provided with an alternative means to conduct static charges and/or light ning currents, as appropriate. c. Static Bonds. All isolated conducting parts inside and outside the aircraft, having an area greater than 3 in2 and a linear dimension over 3 inches, that are subjected to appreciable electrostatic charging due to precipitation, fluid, or air in motion, should have a mechani cally secure electrical connection to the aircraft structure of sufficient conductivity to dissipate possible static charges. A resistance of less than 1 ohm when clean and dry will generally ensure such dissipation on larger objects. Higher resistances are permissible in connect ing smaller objects to airframe structure. 11-188. BONDING INSPECTION. In spect for the following: a. If there is evidence of electrical arc- ing, check for intermittent electrical contact between conducting surfaces, that may become a part of a ground plane or a current path. Arcing can be prevented either by bonding, or by insulation if bonding is not necessary. b. The metallic conduit should be bonded to the aircraft structure at each termi nating and break point. The conduit bonding strap should be located ahead of the piece of equipment that is connected to the cable wire inside the conduit. c. Bond connections should be secure and free from corrosion. d. Bonding jumpers should be installed in such a manner as not to interfere in any way with the operation of movable components of the aircraft. Par 11-186 Page 11-73PDF Image | AFS-640
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