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When building molds that will be used with high temperature curing applications, first es- tablish the target post-cure temperature of the part. Consider the highest and lowest tem- peratures at which the resin system will cure. Then consider the size of the structure to be cured and the type of mold construction you would like to use. All of these factors affect the post-cure schedule (the rate of temperature increase and length of cure time). The cure temperature of the mold and plug are based on the established target temperature of the part. The mold should be post-cured at a higher temperature than the part. The plug should be post-cured at a higher temperature than the mold. If, for example, the part will be cured at 140°F (60°C), the mold should be cured at 150°F (66°C), and the plug should be post-cured at 160°F (71°C). The objective is to keep the mold below the temperature at which it was post-cured. This way, the mold or plug can be used without exceeding the HDT (heat deflection temperature) of their structure’s resin system. When choosing materials for the mold, consider the fact that a cored mold will not transfer heat as well as a solid laminate. The core in a composite sandwich mold will act as an insula- tor. If a core is also used in the part being laminated, the skin between the mold surface and the part core will not warm up as well as the skin on the other side of the core. If there is a large temperature difference between the inner skin and the outer skin, the part could prerelease or distort during the post-cure. Verify the dimensional stability of the core mate- rial you intend to use for the intended post-cure temperature. Call or write the WEST SYSTEM technical staff if you have questions about mold building, post-curing at elevated temperatures or epoxy systems with higher thermal properties. Vacuum Bagging Molds 15 3PDF Image | Vacuum Bagging Techniques 002150
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