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9/8/98 AC 43.13-1B (1) To prevent or minimize disassem bly, or reassembly. (7) (8) MIL-C-14550, Copper Plating. MIL-G-45204, Gold Plating. (2) size). Resizing worn components (plate to Filling in damaged or corroded ar To plate small areas of extremely (3) eas. (4) (1) Areas to be repaired by this process should be limited to small areas of large parts, particularly electrical or electronic parts. (2) All solutions should be kept clean and free from contamination. Care should be taken to insure that the solutions are not con taminated by used anodes or other plating so lutions. Brush-plating solutions are not de signed to remove large amounts of scale, oil, or grease. Mechanical or chemical methods should be used to remove large amounts of scale or oxide. Use solvents to remove grease or oil. (3) Brush-plating solutions are five to fifty times as concentrated as tank solutions. The current densities used range from 500 to 4,000 amps/feet2. The voltages listed on the solution bottles have been precalculated to give proper current densities. Too high a cur rent density burns the plating, while too low a current density produces stressed deposits and low efficiencies. Agitation is provided by an ode/cathode motion. Too fast a motion results in low efficiencies and stressed deposits, and too slow a motion causes burning. A dry tool results in burnt plate, coarse grain structure, and unsound deposits. The tool cannot be too wet. Solution temperatures of 110 °F to 120 °F are reached during operation. (4) Materials such as stainless steel, aluminum, chromium, and nickel (which have a passive surface) will require an activating operation to remove the passive surface. Dur ing the activating process, do not use solutions Page 4-47 large parts. (5) To plate electrical contacts. (6) To plate parts too large for existing baths. (7) To supplement conventional plating. (8) To plate components which become contaminated if immersed in a plating bath. (9) To cadmium-plate ultrahigh strength steels without hydrogen embrittlement. (10) On-site plating. (11) Reverse current applications (e.g., stain removal, deburring, etching, and dynamic balancing). standards. (1) QQ-C-320, Chromium Plating. (2) QQ-N-290, Nickel Plating. (3) QQ-P-416, Cadmium Plating. (4) QQ-S-365, Silver Plating. (5) QQ-Z-325, Zinc Plating. (6) MIL-T-10727, Tin Plating. Par 4-62 Selective (electrodepositions), when properly applied, will meet the following specifications and b. Specifications. plating c. General Requirements.PDF Image | AFS-640
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